Junction temperature estimation method for a 600 V, 30A IGBT module during converter operation

نویسندگان

  • Uimin Choi
  • Frede Blaabjerg
  • Francesco Iannuzzo
  • S. Jørgensen
چکیده

On-line VCE_ON and VF Measurement This paper proposes an accurate method to estimate the junction temperature using the on-state collector-emitter voltage and load current. By the proposed method, the estimation error which comes from the different temperatures of the interconnection materials in the module is compensated. Finally, it leads to satisfactory estimated results. The proposed method has been verified by means of an IR (Infra-Red) camera during power converter operations when the loading current is sinusoidal..

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

On-Line Junction Temperature Monitoring of Switching Devices with Dynamic Compact Thermal Models Extracted with Model Order Reduction

Residual lifetime estimation has gained a key point among the techniques that improve the reliability and the efficiency of power converters. The main cause of failures are the junction temperature cycles exhibited by switching devices during their normal operation; therefore, reliable power converter lifetime estimation requires the knowledge of the junction temperature time profile. Since on-...

متن کامل

Online junction temperature estimation for IGBT modules with paralleled semiconductor chips

The paper presents methods for the online estimation of the junction temperature (Tj) for IGBT modules with paralleled semiconductor chips, with each chip operating at different junction temperatures. Experimental and simulation results are presented. The Tj estimated from the gate-emitter voltage (Vge) during the IGBT switch off process was found to be very close to the average junction temper...

متن کامل

Novel Electro-Thermal Coupling Simulation Technique for Dynamic Analysis of HV (Hybrid Vehicle) Inverter

This paper describes a novel electro-thermal coupling simulation technique mainly focused on the dynamic analysis of the HV inverter during WOT (Wide Open Throttle) operation. This technique can predict the junction temperature of power devices installed within the power module accurately. This simulation technique is composed of an inverter circuit model including power semiconductor device mo...

متن کامل

Hybrid SiC Power Module with Low Power Loss

Mitsubishi Electric has developed a 1.7 kV hybrid SiC power module consisting of 6th generation Si-IGBT and SiC Schottky Barrier Diode (SBD). Adopting SiC-SBD enables a significant power loss reduction during the diode turn-off and IGBT turn-on. And adopting of 6th generation IGBT enables the reduction of the IGBT turn-off loss. By using the newly developed chip set, high temperature enduring g...

متن کامل

Simultaneous online estimation of junction temperature and current of IGBTs using emitter-auxiliary emitter parasitic inductance

A novel method is presented for online estimation of the junction temperature (Tj) of semiconductor chips in IGBT modules, based on the voltage drop (VEE’) across the parasitic inductor that exists between the main emitter (E) and auxiliary emitter (E’) terminals. The peak amplitude of the voltage drop (VEE’) was found to depend on the junction temperature at a known current and DC link voltage...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:
  • Microelectronics Reliability

دوره 55  شماره 

صفحات  -

تاریخ انتشار 2015